#SMT

Surface-mounted device

Surface-mounted technology (SMT) is a technical term from electronics. In contrast to Through Hole Technology (THT), the “wired components”, the connections of the components are not inserted through a hole in the circuit board but fitted and soldered directly on the surface of the circuit board using connection surfaces. A higher packing density and lower production costs per component are possible with this highly automated technology.

# SE-TEC SMT 01 // HIGH TEC PRINT

Precise high-tech

stencil printing

The trend towards ever smaller components and finer structures requires the highest precision and repeatability in the screen-printing process. For these reasons, we rely on the fully automated JUKI GKG stencil printer in this important process step, which is the basis for all subsequent processes. To ensure that we achieve consistently high quality from the first to the last circuit board in the series, all relevant parameters are matched to your product and saved in the stencil printer. The alignment of the circuit boards and the cleaning of the stencils are carried out fully automatically to achieve perfect results.

Flexible high-mix

SMT assembly

SMT machine assembly is no secret and we know that a high assembly speed alone is no longer enough to impress you today. That is why we offer you an unprecedented level of flexibility through the use of the latest assembly technology.

Special feeders enable us to load and unload the components within a few seconds. In addition, to avoid setup errors and to achieve even shorter machine setup times, all components are verified by means of barcodes. A wide range of components that can be assembled from 01005 to BGA with 56mm x 56mm gives us the certainty that we are ready today for tomorrow’s tasks.

# SE-TEC SMT 02 // Juki linie

Reliable

reflow-soldering

In the area of ​​reflow soldering, we rely on a fully assembled soldering system from Rehm. Through constant control of the process parameters by means of internal monitoring and a soldering profile adapted to your product, we achieve minimal thermal stress on the sensitive components and an optimal soldering result.

# SE-TEC SMT 03 // REFLOW SOLDERING

#THT

Through Hole Technology

In electronics, the assembly and connection technology of wired electronic and electromechanical components is referred to as through-hole assembly (THT). This technology offers a high electrical and mechanical resilience of the components and soldered connections.

#THT

Through Hole Technology

Conventional

assembly

Our conventional production is equipped with trained specialists and modern equipment. In this way, we guarantee a high level of process reliability when processing wired components in wave, selective and hand soldering.

# SE-TEC THT 01 // ASSEMBLY

Selective

soldering

With selective soldering, we close the gap between hand soldering in the sample and small series sector and masked wave soldering in the larger series. The advantages compared to hand soldering are more efficient production, a reproducible process and an increase in the quality of the soldering joint.

# SE-TEC THT 02 // SELECTIV SOLDERING

Wave

soldering

We use SEHO wave soldering systems with an integrated spray fluxer for RoHS-compliant wave soldering or, on request, leaded wave soldering. With these microprocessor-controlled systems we can solder the complete range of assemblies from SMD to THT to mixed assemblies.

# SE-TEC THT 03 // WAVE SOLDERING

THT components

preparation

We use various axial and radial devices to prepare your conventional components.

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Separation

In order to prevent unnecessary stress on components and printed circuit boards, all printed circuit board panels are professionally separated with panel separators.

 # SE-TEC THT 04// SEPARATE

#INSPECTION

AOI / MOI SYSTEM

AOI

The automatic optical inspection is the basis for a minimal error rate in series production. The programming effort pays for itself through the shorter inspection time – even with smaller quantities.

By using the 3D inspection system VT-S730 from Omron, we inspect with regard to the following quality features:

  • Presence detection
  • Polarity detection
  • Solder joint evaluation
  • Lifted lead detection
  • Short circuit control
  • Optical character recognition (OCR)
  • Height measurement

The VT-S730 inspection system is characterized by the following features:

  • In and offline operation for optimized throughput
  • Colour highlight technology (evaluation with colour process)
  • 3D measurement and representation of solder joints and components

MOI

We use stereomicroscopes with LED lighting for manual optical inspection. So that we don’t miss the smallest detail, we use interchangeable lenses with four, ten and twenty times magnification.

# SE-TEC INSPECTION 01 // MOI

# SE-TEC ISPEKTION 03 // 3D AOI

Cleaning

In order to optimally prepare your assemblies for an upcoming coating, we use an automatic cleaning machine for industrial fine cleaning from the manufacturer Riebesam.

The machine of the 23 series is equipped with two cleaning levels and PLC control for the highest demands on cleaning results, reproducibility and performance.

2K-mixing and -dosing

Potting

With the purchase specifically to meet the requirements of our standard casting compound Henkel casting compound FERMADUR A-690-UL1 / FDUR B-N with a coordinated 2K mixing and dosing system, we can offer you the casting of your assemblies in excellent quality.

# SE-TEC  POTTING 01

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