We are pleased to inform you that SE-TEC GmbH has further expanded its production facilities and now has a system for CNC milling depaneling and laser depaneling.

The combination of individual circuit boards in multiple production panels is an essential step in reducing the handling effort per circuit board and is therefore essential for almost every product.

When it came to the required panel separation, we made a conscious decision not to use conventional dividing separation processes, as these can pose potential risks for sensitive components such as ceramic capacitors. Microcracks in components and solder joints can jeopardize the reliability of the entire assembly. For this reason, we rely on cutting or laser cutting processes from prototype production to series production of sensitive assemblies. The CNC milling depaneling machine offers exact separations with tight tolerances and minimal influences on the components. In addition, the chip is specifically sucked off through channels in order to maintain the necessary cleanliness of the assembly.