SE-TEC GmbH has expanded its production facilities and now offers CNC milling and laser panel cutting.
Combining individual circuit boards into multiple panels significantly reduces the handling effort per circuit board.
When separating, we deliberately use machining and laser-based processes instead of cutting methods. Mechanical separation processes can cause microcracks in components and solder joints, thus compromising reliability.
The CNC milling panel separator enables precise cuts with tight tolerances; chips are extracted via channels to ensure cleanliness.
Laser cutting is contactless and particularly gentle, making it ideal for sensitive assemblies. We can offer attractive conditions and short turnaround times for demanding assemblies. With this investment, we are strengthening the quality and reliability of your products.
Contact us for further information or to arrange a visit to our premises.
Yours sincerely, Sebastian Schollmeyer / Operations Manager
