SMT-Assembly
Quality assembly
precise, flexible, made in Germany
SE-TEC offers precise SMT assembly for modern printed circuit boards: high packing density, reproducible quality, and competitive prices — manufactured in Germany.
Stencil printing
Screen printing for solder paste requires maximum precision and repeatability. We use fully automated JUKI GKG stencil printers and store product-specific printing profiles. Alignment and stencil cleaning are performed automatically, ensuring consistent results for every circuit board.
HighMix SMT assembly
Barcode verification prevents setup errors, while special feeders reduce setup times. We assemble components ranging from 01005 to BGA 56 mm × 56 mm and are equally suited to small and large series production.
Reflow Soldering
For reliable soldered connections, we rely on fully automated reflow systems with continuous process monitoring. Product-specific soldering profiles ensure optimal results and prevent thermal overload of sensitive components.
Precise, Flexible & High Quality
Your visible advantage
- High precision thanks to automated processes
- Wide range of components from 01005 to BGA 56 mm × 56 mm
- Short setup times thanks to special feeders and BarcodeCheck
- Consistent quality thanks to stored process parameters
- Manufactured in Germany for reliability and short delivery routes
Frequently asked questions (FAQ) about SMT-Assembly
What is SMT assembly?
SMT assembly refers to the automatic placement of surface-mount components on printed circuit boards. This technology enables the compact, precise, and cost-effective manufacturing of modern electronic assemblies.
SE-TEC uses state-of-the-art SMT production lines and manufactures assemblies ranging from prototypes to mass-production runs.
Which components can be processed in SMT manufacturing?
In its SMT manufacturing process, SE-TEC handles, among other things, small passive components, fine-pitch components, QFN and BGA packages, and other complex package types. The company is also capable of manufacturing complex layouts and densely populated printed circuit boards.
Feasibility is assessed on a project-by-project basis based on manufacturing data, component specifications, and quality requirements.
What soldering methods does SE-TEC use in SMT manufacturing?
In SMT manufacturing, SE-TEC relies on reflow soldering with monitored process parameters and soldering profiles tailored to the product. For thermally demanding assemblies and complex PCB designs,
vapor-phase soldering can also be used.
This makes it possible to create reliable solder joints even in complex assemblies, with high thermal mass, or with sensitive components.
What are the advantages of vapor-phase soldering?
Vapor-phase brazing enables particularly uniform heat transfer and, due to the nature of the process, limits the maximum brazing temperature. This is advantageous for thermally demanding assemblies, high copper content, or sensitive components.
SE-TEC uses vapor-phase soldering, particularly in applications that require exceptionally stable soldering processes and a high degree of process reliability.
How is solder paste application ensured in the SMT process?
Screen printing for solder paste requires maximum precision and repeatability. SE-TEC uses fully automated stencil printers with product-specific print profiles, automatic alignment, and stencil cleaning.
The subsequent automatic solder paste inspection checks the printing process before the circuit boards are sent on to the assembly line. This ensures that only flawlessly printed circuit boards are processed further.
Consistent and verified solder paste application is the foundation for reliable solder joints and reproducible manufacturing quality.