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Automated selective coating process
SE-TEC GmbH is expanding its range of services with a new coating system, the MYC50 from Mycronic.
The system features laser height measurement, heating modules, and closed-loop control.
This enables us to achieve precise dosing and even distribution of the coating material. Three different valves cover a wide range of applications: a spray valve for large areas, a needle valve for hard-to-reach areas, and a dispenser for applying dam material to keep connectors clear.
SE-TEC GmbH invests in panel cutting processes for maximum precision and assembly reliability
SE-TEC GmbH has expanded its production facilities and now offers CNC milling and laser panel cutting.
Combining individual circuit boards into multiple panels significantly reduces the handling effort per circuit board.
When separating, we deliberately use machining and laser-based processes instead of cutting methods. Mechanical separation processes can cause microcracks in components and solder joints, thus compromising reliability.
Electronics manufacturing is an art in itself
In June 2020, we presented our new building to you. Today, it has become a place where art and electronics manufacturing come together. Works of art accompany you in corridors and offices. This combination creates an inspiring atmosphere and promotes the creativity of our employees.
New SMT line for small to medium quantities
We are pleased to announce that SE-TEC GmbH has expanded its production capacities. Two Mycronic MY300 placement machines, a fully automatic Juki G Titan stencil printer, and the necessary handling systems have been newly installed. In addition to prototype and series production, we now also offer efficient inline production for small and medium batch sizes (50–500 circuit boards per batch).
Certification according to DIN EN 16247-1
Economical energy use strengthens energy security in Germany and supports climate protection. That is why we commissioned Giese & Bickel Energie GbR to conduct an energy audit in accordance with DIN EN 16247-1.
Conversion of THT production area and selective soldering system
The construction of our new company building enabled us to redesign the THT production area. A separate assembly area with two assembly lines for the final assembly of electronic devices was set up on the ground floor.
Site expansion
The groundbreaking ceremony took place in spring 2019. The extension was completed on schedule in July 2020. Shortly afterwards, SMT production and administration moved in.
The SMT area on the ground floor covers 600 m². The space is sufficient for the existing equipment and offers capacity for expanding the machine park. The first floor houses a large semi-finished parts warehouse, the entire administration area, and three meeting rooms. All rooms are equipped with modern air conditioning and ventilation systems and offer a high level of working comfort.
Expansion of production and storage space
With this expansion, we are laying the foundation for meeting the demands of the new decade and further expanding our capacity.
A three-story extension is being built to the east of the existing production facility. The existing building and the new building will be connected by bridges on the ground floor and first floor.
New Project Management Assistant
We welcome Ms. Sandra Ludewig as our first project management assistant.
She will support the project management team in customer and supplier communication, parts list processing, obtaining and evaluating quotations, deadline monitoring, and quotation preparation.
DIN EN ISO 9001: 2015 Certificate
ISO 9001:2015 builds on the 2008 standard. Those responsible should review the following areas of activity:
Strategic orientation; target groups; process management; responsibilities; risk management; knowledge management; documentation.
Initial certification took place in 2014. Recertification according to DIN EN ISO 9001:2015 by DEKRA took place on April 19, 2017.